Tool Loadport Station(TLP)
For non-vacuum environments housing wafers, a positive pressure and closed-loop control system are employed for purging, utilizing the fab's power system (N2/XCDA).
For the first time in China, MeetFuture's TLP1.0 has significantly reduced the humidity of FOUP to below RH1% in a remarkably short time.
Optional configuration: Standard position sensor, temperature and humidity sensor, pressure gauge, flowmeter, optional MFC
Optional configuration: Standard position sensor, temperature and humidity sensor, pressure gauge, flowmeter, optional MFC
Feature Highlights:
User-friendly man-machine interface
Stable system integration
Stand-alone control board
High-speed purge
Compatibility with multiple EAP communications
Software Description
TLP Software
TLP Software
An intelligent, efficient, stable, and professional host software, coupled with a customized purging strategy and comprehensive status monitoring, ensures the cleanliness and humidity stability within the wafer cassette, thereby preserving the wafer's characteristics and quality.
Feature Highlights:
? Supports standard three-stage purging control.
? With FabScope, it can display the current operational status information of all equipment.
Feature Highlights:
? Supports standard three-stage purging control.
? With FabScope, it can display the current operational status information of all equipment.
Important Parameters
| Technical Indicators | Parameters |
| Clean Grade | ≤Class100 |
| Filtration Precision | 0.003um |
| Power Source | 220V,50Hz,2A |
Related Product Recommendations